SiC Laser Stripping Machine

In the rapidly developing fields such as new energy vehicles and high-end chips, there is a key material called silicon carbide (SiC), hailed as the "diamond of the semiconductor industry". With its excellent performance, it has become one of the cores of industrial upgrading. However, precisely and efficiently cutting this hard "diamond" into thin slices or precision devices is a world-class challenge. A technology enterprise focusing on the R&D of third-generation semiconductor material processing equipment is facing such a dilemma. Sinsegye’s involvement has brought it a brand-new solution — instead of manufacturing a new cutting machine, we equipped it with a set of independently controllable "smart brain", thus driving the equipment to achieve a qualitative leap.