Laser Rounding Machine

With the widespread application of silicon carbide (SiC) devices in high-end fields such as new energy vehicles, photovoltaic power, and rail transit, the market demand for large-size silicon carbide wafers of 8 inches and above is becoming increasingly urgent. However, traditional diamond wire cutting processes face issues such as low efficiency, high costs, and difficult precision control when dealing with large-size, high-hardness wafers, which severely restrict capacity release and yield improvement.