SiC Laser Stripping Machine

Industry Case Background

In the rapidly developing fields such as new energy vehicles and high-end chips, there is a key material called silicon carbide (SiC), hailed as the "diamond of the semiconductor industry". With its excellent performance, it has become one of the cores of industrial upgrading. However, precisely and efficiently cutting this hard "diamond" into thin slices or precision devices is a world-class challenge. A technology enterprise focusing on the R&D of third-generation semiconductor material processing equipment is facing such a dilemma. Sinsegye’s involvement has brought it a brand-new solution — instead of manufacturing a new cutting machine, we equipped it with a set of independently controllable "smart brain", thus driving the equipment to achieve a qualitative leap.

Core Pain Points

• Insufficient Precision: The edges are prone to chipping and burrs during cutting, and the size is difficult to control accurately, failing to meet the nearly stringent process requirements of high-end devices.
• Low Efficiency: The processing path is not intelligent enough, leading to excessive idle running and frequent start-stop of the equipment, which not only prolongs the production cycle but also causes heavy equipment wear.
• Poor Adaptability: Dozens of parameters such as laser power and speed need to be repeatedly adjusted for workpieces of different specifications. The debugging is cumbersome, making it difficult to adapt to the flexible production needs of small batches and multiple varieties.
• High Reliance on Manual Work: The processing process lacks intuitive preview and real-time monitoring, and is highly dependent on the experience of senior technicians, resulting in coexisting safety and quality risks.

Scene Architecture Diagram

Advantages of Sinsegye's Solution

1.Index Breakthroughs

• The cutting size error is stably controlled at the micron level, and the cut surface is smooth without chipping, meeting the manufacturing standards of high-end devices in one fell swoop.
• Through intelligent path optimization and rapid "recipe" switching, the overall production efficiency is increased by 30%, and the equipment utilization rate is greatly improved.
• The processing process is controllable and visible, the product qualification rate has jumped to 99%, and the equipment operation is more stable.

2.User-Friendly and Open

• The intuitive visual interface and convenient functions enable new employees to take up their posts quickly, reducing the enterprise’s reliance on senior technicians.
• It easily copes with the production tasks of multiple varieties and small batches, helping customers respond to market demands agilely.