
Fully automatic dual station laser merging and coding machine
The fully automatic dual station laser parallel coding machine includes a code reading gun, laser ranging system, MES interaction, and multiple station laser marking. It is currently used for coding and marking single crystal silicon rods, and is also used for round and square rods. The overall equipment adopts a modular design, consisting ......

Double CNC flat cutting machine
The dual CNC flat cutting machine is our company's first equipment type, which includes code reading, MES interaction, motion control system, pneumatic system, laser marking system, laser cutting system, etc. It is a comprehensive equipment suitable for cutting and coding brittle materials such as monocrystalline silicon. The main ......

Fully automatic lens thickness detection equipment
The lens thickness detection equipment consists of multiple parts such as motion control system, spectral confocal detection system, pneumatic part, automatic calibration part, adaptive adjustment system, etc. Previously, the device used a combination of a microcontroller and an industrial computer for execution, which resulted in low overall ......

Silicon wafer sorting machine
Silicon wafer sorting machine is a device for sorting crystalline silicon wafers, which detects and sorts them according to appearance, printing, and electrical characteristics.
At present, domestic silicon wafer manufacturers mainly use manual sorting methods, which are inefficient, costly, and harmful to workers' health. However, the use of ......

Intelligent crystal pulling system for single crystal furnace
The intelligent one click crystal pulling system designed by one of the top three system suppliers in the single crystal furnace self-control industry is a new generation of intelligent crystal growing system for silicon single crystal growth furnaces. It is based on the high intelligence visual inspection algorithm developed by the intelligent ......

Eutectic surface mount machine
The eutectic surface mount machine is a critical semiconductor manufacturing tool that is very important in the field of microelectronic component assembly. Its advantages can improve manufacturing efficiency, reduce costs, and enhance product quality. This device mainly performs a series of operations such as preheating, positioning, suction ......

Thin film deposition equipment
Thin film deposition equipment is mainly responsible for the deposition of dielectric and metal layers in various process steps, including CVD (chemical vapor deposition), PVD (physical vapor deposition), and ALD (atomic layer deposition), among which ALD belongs to the branch of CVD. According to different deposition processes, thin film ......

ALD atomic deposition system
Atomic layer deposition (ALD) is a thin film preparation technique that grows layer by layer at the atomic level. The ideal ALD growth process involves selectively alternating and exposing different precursors to the surface of the substrate, where they chemically adsorb and react to form deposited thin films.A complete ALD growth cycle can be ......

Wet cleaning technology for wafers
Wet cleaning process is a process that uses chemical treatment, gas, and physical means to remove impurities from the surface of wafers. By promoting chemical reactions between impurities and solvents, soluble substances, gases, or direct exfoliation are generated to achieve cleaning goals.With the continuous reduction of nanoscale in ......