Semiconductor Industry
Silicon wafer sorting machine
Silicon wafer sorting machine is a device for sorting crystalline silicon wafers, which detects and sorts them according to appearance, printing, and electrical characteristics.
At present, domestic silicon wafer manufacturers mainly use manual sorting methods, which are inefficient, costly, and harmful to workers' health. However, the use of ......
Intelligent crystal pulling system for single crystal furnace
The intelligent one click crystal pulling system designed by one of the top three system suppliers in the single crystal furnace self-control industry is a new generation of intelligent crystal growing system for silicon single crystal growth furnaces. It is based on the high intelligence visual inspection algorithm developed by the intelligent ......
Eutectic surface mount machine
The eutectic surface mount machine is a critical semiconductor manufacturing tool that is very important in the field of microelectronic component assembly. Its advantages can improve manufacturing efficiency, reduce costs, and enhance product quality. This device mainly performs a series of operations such as preheating, positioning, suction ......
Thin film deposition equipment
Thin film deposition equipment is mainly responsible for the deposition of dielectric and metal layers in various process steps, including CVD (chemical vapor deposition), PVD (physical vapor deposition), and ALD (atomic layer deposition), among which ALD belongs to the branch of CVD. According to different deposition processes, thin film ......
ALD atomic deposition system
Atomic layer deposition (ALD) is a thin film preparation technique that grows layer by layer at the atomic level. The ideal ALD growth process involves selectively alternating and exposing different precursors to the surface of the substrate, where they chemically adsorb and react to form deposited thin films.A complete ALD growth cycle can be ......
Wet cleaning technology for wafers
Wet cleaning process is a process that uses chemical treatment, gas, and physical means to remove impurities from the surface of wafers. By promoting chemical reactions between impurities and solvents, soluble substances, gases, or direct exfoliation are generated to achieve cleaning goals.With the continuous reduction of nanoscale in ......